(MYS) Packaging Engineer
Melaka - Experienced - Full-time
Job ID 12191BR Job Posting Title Packaging Engineer Job Description Responsible for developing wire bond solution on new/novel packages, qualification of new wires types/diameters, new silicon nodes using Au/Cu/PCC wires on various type of bond pad structures, with hands-on wire bond experience on wire bonder device setup, conversion, wire bond recipe generation, wire bonder error trouble shooting, wire bond MTBA/PPH improvement, to support new products or cost saving initiatives. Hands-on experience on KNS bonders (Maxum, ConnX, or higher model of bonders) will be added advantage. Job...
12-03-2015 - arca24.com